News: Reads from WWW
Tuesday, 14 Aug 2012
Black Samsung Galaxy S III Set to Debut in UK in Four to Six Weeks
UK smartphone retailer MobileFun has launched a pre-order page for a black edition of the Samsung Galaxy S III, adding another to an existing palette of three colors for the popular smartphone.
Two Samsung Dual-core WP8 Devices Disclosed, Both Slated for Q4 Release (Update)
Due to the progressing Apple vs Samsung trial, Samsung has "accidentally" revealed at least two dual-core WP8 devices, nicknamed "Odyssey" and "Macro", in its court documents.
ARM and GlobalFoundries Collaborating on 20nm SoC Featuring FinFET Technology
ARM and GlobalFoundries have announced their collaboration to produce system-on-chip (SoC) solutions based on the latter's 20nm fabrication process and FinFET transistors. This will help achieve better system performance and power-efficiency for a range of mobile applications.
Monday, 13 Aug 2012
Toshiba to Increase HDD Production by 35% to Meet Demand
Toshiba will be boosting production of hard drives by about 35% in the next three years to meet increasing demand from data centers and PC manufacturers.
Friday, 10 Aug 2012
First Nokia WP8 Smartphone Aesthetically Similar to Lumia 900 and 800?
Pictures published of an unannounced Nokia smartphone earlier this week have allegedly been confirmed to be authentic ones of the first Nokia WP8 smartphone, according to Nokia Innovation.
iOS 6 Reportedly Introducing New "WiFi plus Cellular" Feature
Apple is allegedly introducing a new "WiFi plus Cellular" option in the eagerly-anticipated iOS 6. This new feature will intelligently switch between WiFi and cellular data for optimal performance.
HTC Rolling Out WP8 Devices in Third Week of Sep? (Update)
Following an earlier leaked WP8 line-up, WPDang has added allegations that HTC will be launching new Windows Phone 8 devices during the third week of September.
Wednesday, 8 Aug 2012
iPhone 5 a Mere 7.6mm Thin, 18% Slimmer Than iPhone 4S?
According to a report by a Chinese language newspaper, the upcoming next-gen iPhone is said to be only 7.6mm thick, 18% thinner than the iPhone 4S.
Monday, 6 Aug 2012
Microsoft to Reinforce OEM Activation Process for Windows 8?
According to leaked slides on the Internet, Microsoft will be updating its OEM Activation mechanism to version 3.0 for the upcoming Windows 8. OA 3.0 will allow OEMs to digitally order and receive keys from Microsoft. Also, an exclusive product key is required to be written into each PC.
Monday, 28 May 2012
AMD Add-in Manufacturers Supposedly Working on Radeon HD 7970 X2
AMD add-in partners are rumored to be working on a customized Radeon HD 7970 X2 graphics card which will feature two 28nm Tahiti GPUs; their efforts are reportedly sanctioned by AMD.