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More Details on Intel's Haswell Architecture Surface

More Details on Intel's Haswell Architecture Surface

More details of Intel's upcoming Haswell architecture has emerged, according to CPU World who reported on the package options that we can expect to see on this new generation of processors based on this new architecture.

Like the current Ivy Bridge processors, the Haswell CPUs will be manufactured using 22nm fabrication process and 3D tri-gate transistors. In terms of the new CPU specifications, Intel will use a "A + B + C" format, where CPU core count, graphics tier level and the number of memory channels are represented in that order.

For the new desktop offerings, Intel will use the following package options:-

  • "4 + 2 + 2"
  • "2 + 2 + 2"

These desktop processors will be featured in an LGA package, with support for DDR3-1600 memory up to a maximum capacity of 32GB. The mobile Haswell CPUs will be available in following packages options:-

  • "4 + 3 + 2"
  • "4 + 2 + 2"
  • "2 + 2 + 2"

CPU World reported that mobile Haswell processors, with the highest graphics option of GT3, will be only available in a BGA package. With the exception of the lower-end mobile processor for Ultra Light and Thin (ULT) devices, all mobile chips will have two memory controllers and support either 16GB or 32GB of RAM.

The ULT mobile CPUs are dual-core, one package will use the GT3 graphics while the other will use the lower tier GT2. Both will be manufactured using the BGA package, with support for system memory up to maximum capacities of 16GB and 8GB respectively.

(Source: CPU World)

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